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HFBR-0500ETZ series versatile link the versatile fiber optic connection data sheet features ?? extended temperature range -40 to +85 c ?? rohs-compliant ?? low cost fi ber optic components ?? enhanced digital links: dc-5 mbd ?? link distance up to 43m at 1mbd and 20m at 5mbd ?? low current link: 6 ma peak supply current ?? horizontal and vertical mounting ?? interlocking feature ?? high noise immunity ?? easy connectoring: simplex, duplex, and latching connectors ?? flame retardant ?? transmitters incorporate a 660 nm red led for easy visibility ?? compatible with standard ttl circuitry applications ? industrial drives/frequency inverters ? renewable energies (wind turbines, solar pv farms) power electronics ? reduction of lightning/volt age transient susceptibility ?? motor controller triggering ?? data communications and local area networks ?? electromagnetic compatibility (emc) for regulated systems: fcc, vde, csa, etc. ?? tempest-secure data processing equipment ?? isolation in test and measurement instruments ?? error free signalling for industrial and manufactur ing equipment ?? automotive communica tions and control networks ?? noise immune communica tion in audio and video equipment description the versatile link series is a complete family of fi ber optic link components for applications requiring a low cost solution. the HFBR-0500ETZ series includes trans- mitters, receivers, connec tors and cable specifi ed for easy design. this series of compo nents is ideal for solving problems with voltage isolation/insula tion, emi/rfi immunity or data security. the optical link design is simpli fi ed by the logic compat ible receivers and complete specifi -cations for each component. the key optical and electrical parameters of links confi gured with the HFBR-0500ETZ family are fully guaranteed from -40 to 85 c. a wide variety of package confi g u ra tions and connectors provide the designer with numerous mechanical solutions to meet application requirements. the transmitter and receiver compo nents have been designed for use in high volume/low cost assembly processes such as auto inser- tion and wave soldering. transmitters incorporate a 660 nm led. receivers include a monolithic dc coupled, digital ic receiver with open collector schottky output transistor. an internal pullup resistor is avail able for use in the hfbr-25x1etz and hfbr-25x2etz receivers. a shield has been integrated into the receiver ic to provide additional, localized noise immunity. internal optics have been optim ized for use with 1 mm diameter plastic optical fi ber. versatile link specifi cations incorporate all connector interface losses. therefore, optical calculations for common link applications are simplifi ed.
2 available option C horizontal package hfbr-x521etz hfbr-x522etz available option C vertical package hfbr-x531etz hfbr-x532etz available option C 30 tilted package hfbr-x541etz hfbr-x542etz link selection guide (links specifi ed from -40 to 85 c, for plastic optical fi ber unless specifi ed.) signal rate distance (m) 25 c distance (m) transmitter receiver 1 mbd 67 43 hfbr-15x2etz hfbr-25x2etz 5 mbd 38 20 hfbr-15x1etz hfbr-25x1etz HFBR-0500ETZ series part number guide hfbr-x5xxetz 1 = transmitter 2 = receiver et = extended temperature range z = rohs compliant 5 = 600 nm transmitter and receiver products 1 = 5 mbd high performance link 2 = 1 mbd high performance link 2 = horizontal package 6 = 155 mbd receiver 3 = vertical package 7 = 155 mbd transmitter 4 = 30 tilted package
3 valox ? is a registered trademark of the general electric corporation. application literature application note 1035 (versatile link) package and handling information the compact versatile link pack age is made of a fl ame retardant valox ? ul 94 v-0 material (ul fi le # e121562) and uses the same pad layout as a standard, eight pin dual-in-line package. vertical and horizontal mountable parts are available. these low profi le versa tile link pack- ages are stackable and are enclosed to provide a dust resistant seal. snap action simplex, simplex latching, duplex, and duplex latching connectors are off ered with simplex or duplex cables. package orientation performance and pinouts for the vertical and hori- zontal packages are identical. to provide addi tional attachment support for the vertical versatile link housing, the designer has the option of using a self- tapping screw through a printed circuit board into a mounting hole at the bottom of the package. for most applications this is not necessary. package housing color versatile link components and simplex connectors are color coded to eliminate confusion when making connec- tions. receivers are blue and transmit ters are gray. handling versatile link components are auto-insertable. when wave soldering is performed with versatile link compo- nents, the optical port plug should be left in to prevent contamination of the port. do not use refl ow solder processes (i.e., infrared refl ow or vapor-phase refl ow). nonhalogenated water soluble fl uxes (i.e., 0% chloride), not rosin based fl uxes, are recom mended for use with versatile link components. versatile link components are moisture sensitive devices and are shipped in a moisture sealed bag. if the components are exposed to air for an extended period of time, they may require a baking step before the solder- ing process. refer to the special labeling on the shipping tube for details. recommended chemicals for cleaning/degreasing alcohols: methyl, isopropyl, isobutyl. aliphatics: hexane, heptane. other: soap solution, naphtha. do not use partially halogenated hydrocarbons such as 1,1.1 trichloroethane, ketones such as mek, acetone, chloroform, ethyl acetate, methylene dichloride, phenol, methylene chloride, or n-methylpyrolldone. also, avago does not recommend the use of cleaners that use halogenated hydrocarbons because of their potential environmental harm.
4 mechanical dimensions horizontal modules vertical modules 6.86 (0.270) 10.16 (0.400) 4.19 (0.165) 1.27 (0.050) 2.54 (0.100) 0.51 (0.020) 18.8 (0.74) 2.03 (0.080) 7.62 (0.30) 0.64 (0.025) 7.62 (0.300) 2.77 (0.109) 1.85 (0.073) 0.64 (0.025) dia. 5.08 (0.200) 3.81 (0.150) max. 3.56 (0.140) min. 2.03 (0.080) 10.16 (0.400) 5.08 (0.200) 6.86 (0.27) 18.80 (0.740) 18.29 (0.720) 30 tilted modules dimensions in millimeters (inches). dimensions in millimeters (inches). 7.62 (0.300) 2.54 (0.100) 0.4 (0.02) 5.2 (0.21) 10.2 (0.40) b 18.7 (0.74) 30 q 2 (0.08) ? 0.7 (0.03) 0.5 (0.02) 6.6 (0.26) 2.8 (0.11) 15.2 (0.60) 4.6 (0.18) 0.6 (0.03) a 1.1 (0.05) 2.2 (0.09) 19.3 (0.76) 1.3 (0.05) 8.7 (0.34) 10.1 (0.40)
5 versatile link printed board layout dimensions horizontal module vertical module 4 1 3 2 5 8 7.62 (0.300) 1.01 (0.040) dia. 1.85 (0.073) min. pcb edge top view 2.54 (0.100) 7.62 (0.300) dimensions in millimeters (inches). 30 tilted modules dimensions in millimeters (inches). 7.62 (0.300) 2.54 (0.100) 0.5 (0.02) 8.7 (0.34) 1.01 (0.040) bottom view 1.01 (0.040) dia. dia.
6 interlocked (stacked) assemblies (refer to figure 1) horizontal packages may be stacked by placing units with pins facing upward. initially engage the inter - locking mechanism by sliding the l bracket body from above into the l slot body of the lower package. use a straight edge, such as a ruler, to bring all stacked units into uniform alignment. this tech nique prevents potential harm that could occur to fi ngers and hands of assemblers from the package pins. stacked horizontal packages can be disengaged if necessary. repeated stacking and unstack ing causes no damage to individual units. to stack vertical packages, hold one unit in each hand, with the pins facing away and the optical ports on the bottom. slide the l bracket unit into the l slot unit. the straight edge used for horizontal package alignment is not needed. stacking horizontal modules figure 1. interlocked (stacked) horizontal, vertical or 30 tilted packages stacking vertical modules stacking 30 tilted modules
7 figure 2. typical 5 mbd interface circuit 5 mbd link (hfbr-15x1etz/25x1etz) system performance -40 to 85 c unless otherwise specifi ed. parameter symbol min. typ. max. units conditions ref. high data rate dc 5 mbd ber 10 -9 , prbs:2 7 -1 link distance d 17 m i fdc = 60 ma note 3 (standard cable) 33 m i fdc = 60 ma, 25 c link distance d 20 m i fdc = 60 ma note 3 (improved cable) 38 m i fdc = 60 ma, 25 c propagation t plh 90 140 ns r l = 560 ? , c l = 30 pf fig. 3, 6 delay t phl 50 140 ns fi ber length = 0.5 m notes 1, 2 -21.6 p r -9.5 dbm pulse width t d 40 ns p r = -15 dbm fig. 3, 5 distortion t plh -t phl r l = 560 ? , c l = 30 pf notes: 1. the propagation delay for one metre of cable is typically 5 ns. 2. typical propagation delay is measured at p r = -15 dbm. 3. estimated typical link life expectancy at 40 c exceeds 10 years at 60 ma. performance 5 mbd figure 3. 5 mbd propagation delay test circuit
8 figure 6. typical link propagation delay vs. optical power figure 5. typical link pulse width distortion vs. optical power figure 4. propagation delay test waveforms 0 10 20 30 40 50 60 70 -27 -24 -21 -18 -15 -12 -9 -6 p r - input optical power - db m t d - pulse width distortion - ns x5x1etz -40 c x5x1etz 25 c x5x1etz 85 c 0 20 40 60 80 100 -27 -24 -21 -18 -15 -12 -9 -6 p r - input optical power - db m t p - propagation delay - ns t plh x5x1etz t phl x5x1etz
9 hfbr-15x1etz transmitter all hfbr-15xxetz led transmitters are classifi ed as iec 825-1 accessible emission limit (ael) class 1 based upon the current pr oposed draft scheduled to go into eff ect on january 1, 1997. ael class 1 led devices are considered eye safe. contact your local avago sales representative for more information. absolute maximum ratings parameter symbol min. max. units reference storage temperature t s C40 +85 c operating temperature t a C40 +85 c lead soldering cycle temp. 260 c note 1, 4 time 10 sec forward input current i fpk 1000 ma note 2, 3 i fdc 80 reverse input voltage v br 5 v notes: 1. 1.6 mm below seating plane. 2. recommended operating range between 10 and 750 ma. 3. 1 ? s pulse, 20 ? s period. 4. moisture sensitivity level is msl-3 pin # function 1 anode 2 cathode 3 ground 4 ground 5 ground 8 ground note: pins 5 and 8 are for mounting and retaining purposes only. do not electrically connect these pins. anode 1 cathode 2 ground 3 ground 4 8 ground 5 ground
10 figure 7. typical forward voltage vs. drive current f igure 8. normalized typical output power vs. drive current transmitter electrical/optical characteristics -40 to 85 c unless otherwise specifi ed. parameter symbol min. typ. [5] max. units conditions ref. transmitter output p t -16.8 -7.1 dbm i fdc = 60 ma notes 1, 2 -14.3 -8.0 dbm i fdc = 60 ma, 25 c output optical power ? p t / ? t -0.85 %/c temperature coeffi cient peak emission ? pk 660 nm wavelength forward voltage v f 1.43 1.67 2.05 v i fdc = 60 ma forward voltage ? v f / ? t -1.37 mv/c fig. 7 temperature coeffi cient eff ective diameter d 1 mm reverse input breakdown v br 5.0 11.0 v i fdc = 10 ? a, voltage t a = 25 c diode capacitance c o 86 pf v f = 0, f = mhz rise time t r 20 ns 10% to 90%, note 3 fall time t f 20 ns notes: 1. optical power measured at the end of 0.5 m of 1 mm diameter pof (na = 0.5) with a large area detector. 2. optical power, p (dbm) = 10 log [p( ? w)/1000 ? w]. 3. rise and fall times are measured with a voltage pulse driving the transmitter driver ic (75451). a wide bandwidth optical t o electrical waveform analyzer, terminated to a 50 ? input of a wide bandwidth oscilloscope, is used for this response time measurement. optical power i f = 60 ma 1.4 1.45 1.5 1.55 1.6 1.65 1.7 1.75 1.8 1 10 100 i fdc - transmitter drive current ( m a) v f - vorward voltage - v -40 c 25 c 85 c -20 -15 -10 -5 0 5 1 10 100 i fdc - transmitter drive current ( m a) p t - normalized output power - db -40 c 25 c 85 c
11 hfbr-25x1etz receiver absolute maximum ratings parameter symbol min. max. units reference storage temperature t s C40 +85 c operating temperature t a C40 +85 c lead soldering cycle temp. 260 c note 1, 3 time 10 sec supply voltage v cc C0.5 7 v note 2 output collector current i oav 25 ma output collector power dissipation p od 40 mw output voltage v o C0.5 18 v pull-up voltage v p C5 v cc v fan out (ttl) n 5 notes: 1. 1.6 mm below seating plane. 2. it is essential that a bypass capacitor 0.1 ? f be connected from pin 2 to pin 3 of the receiver. total lead length between both ends of the capacitor and the pins should not exceed 20 mm. 3. moisture sensitivity level is msl-3 receiver electrical/optical characteristics -40 to 85 c, 4.75 v v cc 5.25 v unless otherwise specifi ed. parameter symbol min. typ. max. units conditions ref. input optical power p r(l) C21.6 C9.5 dbm v ol = 0.5 v notes 1, level for logic 0 i ol = 8 ma 2, 4 C21.6 C8.7 v ol = 0.5 v i ol = 8 ma, 25 c input optical power p r(h) C43 dbm v ol = 5.25 v note 1 level for logic 1 i oh 250 a high level output current i oh 5 250 ? a v o = 18 v, p r = 0 note 3 low level output voltage v ol 0.4 0.5 v i ol = 8 ma, note 3 p r = p r(l)min high level supply i cch 3.5 6.3 ma v cc = 5.25 v, note 3 current p r = 0 low level supply current i ccl 6.2 10 ma v cc = 5.25 v note 3 p r = -12.5 dbm eff ective diameter d 1 mm internal pull-up resistor r l 680 1000 1700 ? notes: 1. optical fl ux, p (dbm) = 10 log [p (w)/1000 w]. 2. optical power measured at the end of 1 mm diameter pof (na = 0.5) with a large area detector. 3. r l is open. 4. pulsed led operation at i f > 80 ma will cause increased link t plh propagation delay time. this extended t plh time contributes to increased pulse width distortion of the receiver output signal. 4 3 2 1 ground 5 ground 8 r l v cc ground v o 1000 pin # function 1v o 2 ground 3v cc 4r l 5 ground 8 ground note: pins 5 and 8 are for mounting and retaining purposes only. do not electrically connect these pins.
12 1 mbd link (high performance hfbr-15x2etz/25x2etz) system performance under recommended operating conditions unless otherwise specifi ed. parameter symbol min. typ. max. units conditions ref. high data rate dc 1 mbd ber 10 -9 , prbs:2 7 -1 link distance d 37 m i fdc = 60 ma notes 1, (standard cable) 58 m i fdc = 60 ma, 25 c 3, 4 link distance d 43 m i fdc = 60 ma notes 1, (improved cable) 67 m i fdc = 60 ma, 25 c 3, 4 propagation t plh 100 250 ns r l = 560 ? , c l = 30 pf fig. 10, 12 delay t phl 80 140 ns i = 0.5 metre notes 2, 4 p r = -24 dbm pulse width t d 20 ns p r = -24 dbm fig. 10, 11 distortion t plh -t phl r l = 560 ? , c l = 30 pf note 4 notes: 1. for i fpk > 80 ma, the duty factor must be such as to keep i fdc 80 ma. in addition, for i fpk > 80 ma, the following rules for pulse width apply: i fpk 160 ma: pulse width 1 ms i fpk > 160 ma: pulse width 1 ? s, period 20 ? s. 2. the propagation delay for one meter of cable is typically 5 ns. 3. estimated typical link life expectancy at 40 c exceeds 10 years at 60 ma. 4. pulsed led operation at i fpk > 80 ma will cause increased link t plh propagation delay time. this extended t plh time contributes to increased pulse width distortion of the receiver output signal. performance 1 mbd figure 9. required 1 mbd interface circuit the hfbr-25x2etz receiver cannot be overdriven when using the required interface circuit shown in figure 9
13 figure 11. typical link pulse width distortion vs. optical power figure 10. 1 mbd propagation delay test circuit figure 13. propagation delay test waveforms figure 12. typical link propagation delay vs. optical power 0 10 20 30 40 50 60 70 80 90 -27 -24 -21 -18 -15 -12 -9 -6 p r - input optical power - db m t d - pulse width distortion - ns x5x2etz -40 c x5x2etz 25 c x5x2etz 85 c 0 20 40 60 80 100 120 -27 -24 -21 -18 -15 -12 -9 -6 p r - input optical power - db m t p - propagation delay - ns t plh x5x2etz t phl x5x2etz
14 hfbr-15x2etz transmitters all hfbr15xxetz led transmitters are classifi ed as iec 825-1 accessible emission limit (ael) class 1 based upon the current pro posed draft scheduled to go into eff ect on january 1, 1997. ael class 1 led devices are considered eye safe. contact your avago sales representative for more information. absolute maximum ratings parameter symbol min. max. units reference storage temperature t s C40 +85 c operating temperature t a C40 +85 c lead soldering cycle temp. 260 c note 1, 4 time 10 sec forward input current i fpk 1000 ma note 2, 3 i fdc 80 reverse input voltage v br 5 v notes: 1. 1.6 mm below seating plane. 2. recommended operating range between 10 and 750 ma. 3. 1 ? s pulse, 20 ? s period. 4. moisture sensitivity level is msl-3 transmitter electrical/optical characteristics -40 to 85 c unless otherwise specifi ed. for forward voltage and output power vs. drive current graphs. parameter symbol min. typ. max. units conditions ref. transmitter output p t C13.9 C4.0 dbm i fdc = 60 ma note 1 optical power C11.2 C5.1 i fdc = 60 ma, 25 c output optical power ? p t / ? t C0.85 %/ c temperature coeffi cient peak emission wavelength ? pk 660 nm forward voltage v f 1.43 1.67 2.05 v i fdc = 60 ma forward voltage ? v f / ? t C1.37 mv/ c fig. 09 temperature coeffi cient eff ective diameter d t 1 mm reverse input breakdown v br 5.0 11.0 v i fdc = 10 a, voltage t a = 25 c diode capacitance c o 86 pf v f = 0, f = 1 mhz rise time t r 20 ns 10% to 90%, note 2 fall time t f 20 ns i f = 60 ma note: 1. optical power measured at the end of 0.5 m of 1 mm diameter pof (na = 0.5) with a large area detector. 2. rise and fall times are measured with a voltage pulse driving the transmitter driver ic (75451). a wide bandwidth optical t o electrical waveform analyzer, terminated to a 50 ? input of a wide bandwidth oscilloscope, is used for this response time measurement. anode 1 cathode 2 ground 3 ground 4 8 ground 5 ground pin # function 1 anode 2 cathode 3 ground 4 ground 5 ground 8 ground note: pins 5 and 8 are for mounting and retaining purposes only. do not electrically connect these pins.
15 hfbr-25x2etz receivers absolute maximum ratings parameter symbol min. max. units reference storage temperature t s C40 +85 c operating temperature t a C40 +85 c lead soldering cycle temp. 260 c note 1, 3 time 10 sec supply voltage v cc C0.5 7 v note 2 output collector current i oav 25 ma output collector power dissipation p od 40 mw output voltage v o C0.5 18 v pull-up voltage v p C5 v cc v fan out (ttl) n 5 notes: 1. 1.6 mm below seating plane. 2. it is essential that a bypass capacitor 0.1 ? f be connected from pin 2 to pin 3 of the receiver. total lead length between both ends of the capacitor and the pins should not exceed 20 mm. 3. moisture sensitivity level is msl-3 receiver electrical/optical characteristics -40 to 85 c, 4.75 v v cc 5.25 v unless otherwise specifi ed. parameter symbol min. typ. max. units conditions ref. receiver optical input p r(l) C24 -9.5 dbm v ol ? 0.5 v notes 1, 2, 3 power level logic 0 i ol = 8 ma optical input power p r(h) -43 dbm v oh = 5.25 v note 4 level logic 1 i oh = 250 a high level output current i oh 5 250 ? a v o = 18 v, p r = 0 note 5 low level output voltage v ol 0.4 0.5 v i ol = 8 ma note 5 p r = p r(l)min high level supply current i cch 3.5 6.3 ma v cc = 5.25 v, note 5 p r = 0 low level supply current i ccl 6.2 10 ma v cc = 5.25 v, note 5 p r = -12.5 dbm eff ective diameter d 1 mm internal pull-up resistor r l 680 1000 1700 ? notes: 1. optical power measured at the end of 1 mm diameter pof (na = 0.5) with a large area detector. 2. pulsed led operation at i f > 80 ma will cause increased link t plh propagation delay time. this extended t plh time contributes to increased pulse width distortion of the receiver output signal. 3. the led drive circuit of figure 11 is required for 1 mbd operation of the hfbr-25x2etz. 4. optical fl ux, p (dbm) = 10 log [p( ? w)/1000 ? w]. 5. r l is open. 4 3 2 1 ground 5 ground 8 r l v cc ground v o 1000 pin # function 1v o 2 ground 3v cc 4r l 5 ground 8 ground note: pins 5 and 8 are for mounting and retaining purposes only. do not electrically connect these pins.
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2012 avago technologies. all rights reserved. av02-3283en - february 23, 2012

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